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Latest Trends in CCL & PCB Materials: What’s New in 2024-2025
High Tg FR-4 & ultra-high Tg materials.
More demand for halogen-free and RoHS / REACH compliance materials.
Use of polyimide & flexible materials in flexible/rigid-flex boards.
Thinner cores, thinner copper, finer trace / microvias (more HDI boards) driving new demands.
Higher copper weights / thick copper boards for power / high current.
Surface finishes that reduce costs while keeping reliability.
Sustainability: whether materials are recyclable, whether suppliers are certified, whether less waste in production.
Step 1
Design and Output
Step 2
From File to Film
Step 3
Printing the Inner layers
Step 4
Removing the Unwanted Copper
Step 5
Layer Alignment and Optical Inspection
Step 6
Layer-up and Bond
Step 7
PCB Drill
Step 8
Plating and Copper Deposition
Step 9
Outer Layer Imaging
Step 10
Plating
Step 11
Final Etching
Step 12
Solder Mask Application
Step 13
Surface Finish
Step 14
Silkscreen
Step 15
Electrical Test
Step 16
Profiling and V-Scoring
Step 1:
Design and Output
- Circuit boards should be rigorously compatible with, a PCB layout created by the designer using PCB design software. Commonly-used PCB design software includes Altium Designer, OrCAD, Pads, KiCad, Eagle etc. NOTE: Before PCB fabrication, designers should inform their contract manufacturer about the PCB design software version used to design the circuit since it helps avoid issues caused by discrepancies.
- Once the PCB design is approved for production, designers export the design into format their manufacturers support. The PCB industry birthed extended Gerber as the perfect output format. Different PCB design software possibly calls for different Gerber file generation steps, they all encode comprehensive vital information including copper tracking layers, drill drawing, apertures, component notations and other options.