PCB Surface Finishes Compared: HASL vs ENIG vs OSP

The surface finish protects exposed copper and makes it solderable. Picking the right one balances cost, assembly process and reliability.

HASL (Hot Air Solder Levelling)

Cost-effective and widely compatible, available in leaded and lead-free. Great for through-hole and larger SMD parts; less ideal for very fine pitch.

ENIG (Electroless Nickel Immersion Gold)

Flat, durable gold surface ideal for fine-pitch, BGA and long shelf life. Costs more but excels in demanding assemblies.

OSP (Organic Solderability Preservative)

Flat and cost-effective, RoHS-friendly, best for boards assembled soon after manufacture.

• Lowest cost, robust → HASL
• Fine-pitch / BGA / long shelf life → ENIG
• Flat, low-cost, assemble-soon → OSP

Not sure which finish fits your assembly? Send us your spec and we will recommend the best option.